Program Chair

Yingcai Xiao, The University of Akron, USA

MCCSIS General Conference Co-Chairs

Piet Kommers, University of Twente, The Netherlands

Pedro Isaias, The University of New South Wales (UNSW – Sydney), Australia

Committee Members*

Angelica De Antonio, Universidad Politecnica de Madrid, Spain
Brian J. d Auriol, Gwangju Institute of Science and Technology, Republic of Korea
Bruce Campbell, Rhode Island School of Design, USA
Carlo Nati, Working Group for the Development of Technoscientific Knowledge, Italy
Celmar Guimarães da Silva, Universidade Estadual de Campinas, Brazil
Cesar Alberto Collazos, Universidad del Cauca, Colombia
Christos Gatzidis, Bournemouth University, United Kingdom
Creto Vidal, Federal University of Ceará, Brazil
Daniel Wiegreffe, University of Leipzig, Germany
David Wortley, 360in360 Immersive Experiences, United Kingdom
Dongrong Xu, Columbia University, USA
Elefelious Getachew Belay, Addis Ababa University, Ethiopia
Evgin Goceri, Akdeniz University, Turkey
Gerik Scheuermann, Leipzig University, Germany
Jian Chang, Bournemouth University, United Kingdom
John Samuel, CPE Lyon, France
Josip Almasi, Open Computing Ltd, Ireland
Karolj Skala, Rudjer Boskovic Institute, Croatia
Kin Chung Kwan, California State University Sacramento, USA
Krzysztof Okarma, West Pomeranian University of Technology, Szczecin, Poland
Krzysztof Walczak, Poznań University of Economics and Business, Poland
Linda Giannini, ENO Referent, Italy
Luca Grilli, Department of Engineering, University of Perugia, Italy
Marcelo de Paiva Guimaraes, Federal University of São Paulo, Brazil
Mu-Chun Su, National Central University, Taiwan
Nadia Ambrosetti, Universita Degli Studi di Milano, Italy
Peter Dannenmann, RheinMain University of Applied Sciences, Germany
Pierre-frederic Villard, University of Lorraine, France
Qiang Guan, Computer Science, Kent State University, USA
Roman Durikovic, Comenius University in Bratislava, Slovakia
Shaun Bangay, Deakin University, Australia
Theresa-marie Rhyne, Computer Graphics Consultant, USA
Zhong-hui Duan, University of Akron, USA

*committee members are being invited